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A two-component resin is a liquid polymeric material that requires the exact mixing of two separate chemical elements to cure and achieve its final properties: the Resin (Component A) and the Hardener (Component B).

Potting is the process of filling an enclosure or housing that contains an electronic board with a liquid resin. Once cured, the resin completely encapsulates the circuit, becoming an integral part of the object.

Epoxy resin offers maximum chemical and mechanical resistance, as well as excellent adhesion.

Polyurethane (PU) resin is one of the most common choices for electronic potting because it offers an ideal balance of flexibility, protection, and cost, bridging the gap between the extreme rigidity of epoxies and the high cost of silicones.

It is used when massive encapsulation (potting) is required, even for high thicknesses, while ensuring extreme flexibility, maximum thermal resistance, and protection against severe vibrations. It guarantees resistance to extreme temperatures (both low and high), and the reaction occurs uniformly throughout the mass.

It is a thermosetting resin (epoxy, polyurethane) to which mineral, oxide, ceramic, or organic fillers have been added in the form of powders, fibers, microspheres, or granules. These increase electrical insulation or enhance specific properties, such as higher thermal conductivity or superior electrical insulation.

The heat generated by the chemical reaction during the curing process of the resin mixed with the hardener.

Yes, high temperatures can damage sensitive components.

It is the maximum time within which a two-component resin (resin + hardener), once mixed, remains sufficiently fluid to be poured, applied, or processed before it begins to cure.

Post-curing is a secondary thermal treatment that consists of heating a part encapsulated in resin inside a ventilated oven after it has completed its initial cure. It does not serve to harden the material, but rather to complete its chemical structure at a molecular level, finalizing cross-linking and maximizing the Tg (glass transition temperature).

It means the material has passed the vertical burn (V) test by Underwriters Laboratories. The flame extinguishes within 10 seconds after removal of the flame source, and any released drops do not ignite the cotton placed underneath.

No. The resin is not incombustible like metal. It means it is self-extinguishing: it burns when exposed to a direct flame, but stops burning on its own once the flame is removed.

An epoxy adhesive is used in electronics when the project requires maximum structural rigidity, resistance to high temperatures, and electrical insulation in harsh environments.

A polyurethane (PU) adhesive is used in electronics when the device must withstand heavy vibrations, mechanical shocks, or continuous thermal cycling (hot-cold cycles).

It is used when extreme flexibility, maximum thermal resistance, and protection against severe vibrations are required, in scenarios where a rigid structural bond is not needed.

An acrylic adhesive (whether two-component, structural one-component, or UV-curing) is primarily used when high-speed structural bonding is needed on difficult plastics and metals, with the requirement to withstand strong impacts, vibrations, and thermal shocks.

The use of a UV-curing ultraviolet adhesive is mainly driven by the need for extreme speed and total control over the assembly time.

Mainly for fast fixing operations and cost-effective sealing of non-critical components.

A thin polymeric protective film applied onto the surface of the PCB.

Coating has a minimal thickness (30-130 µm) and does not increase the weight or volume of the circuit.

Silicone, which tolerates temperatures up to 250°C.

Yes, flux residues or fingerprints severely compromise adhesion.

By temporary masking using specific tapes or peelable gels.

Checking the coating under black light, thanks to integrated fluorescent tracers.

Filaments of dried paint caused by excessively high air pressure or a paint viscosity that is too high.

Too rapid evaporation of solvents or incorrect distance of the spray gun.

Small voids caused by trapped air bubbles or silicone contamination.

Lack of circuit cleanliness or chemical incompatibility with the flux.

Spraying (manual/automatic), dipping, and brush application, via a stand-alone automated robot or an in-line production system.

It guarantees total repeatability, depositing the exact same amount of fluid in the exact same position every time.

Any fluid, from ultra-low viscosity liquids (solvents, cyanoacrylates) to ultra-dense pastes (silicones, greases).

Yes, 3 or 4-axis (XYZ) systems follow three-dimensional profiles, channels, and circles smoothly and continuously.

It avoids excessive buildup or a lack of fluid that would compromise the seal or function of the part.

It calibrates the fluid dot or line to the milligram, eliminating waste and product dripping.

Yes, it frees operators from repetitive and alienating tasks, allowing them to be relocated to higher-value activities.

Manual mixing easily induces air bubbles, material waste due to incorrect dosing, defective parts to be discarded at the end of the line, and production slowdowns. A machine eliminates human error, significantly limits bubble formation, guarantees repeatability, and consumes only the required resin. Furthermore, it prevents the operator from accidentally coming into contact with the product.

It eliminates human error, ensuring the maintenance of the correct resin-to-hardener ratio.

It ensures the optimal achievement of specifications regarding hardness, electrical insulation, and thermal resistance.

The equipment mixes only the exact amount needed at the moment of dispensing.

It reduces direct contact and exposure to toxic vapors from hardeners or isocyanates to zero.

No, disposable static mixers can be replaced in a few seconds without the need for flushing with chemical solvents.

Needles with stainless steel cannulas, tapered plastic needles (Smoothflow), flexible Teflon needles, and nozzles for various uses (e.g., cyanoacrylates, UV, etc.).

Tapered needles reduce backpressure, making them ideal for highly dense, viscous, or particle-filled fluids.

For ultra-low viscosity liquids (watery liquids) or cyanoacrylates, to prevent the glue from crystallizing inside the needle.

A short cannula reduces flow resistance and increases precision; a long cannula is used to reach deep areas.

It identifies the international standard for the internal diameter (Gauge): a higher Gauge corresponds to a smaller hole.

By using a valve with a suck-back function (snuff-back) or by reducing the distance between the needle and the part.

Yes, if the internal diameter of the needle is less than 7-10 times the maximum dimension of the particles contained in the fluid.

Halving the internal diameter of the needle quadruples the backpressure, requiring much more force to push the fluid.

No, for reactive fluids (such as polyurethanes or epoxies) they are considered single-use to avoid contamination and micro-obstructions.

Due to an error in the mixing ratio, a temperature that is too low, or the entrapment of moisture.

Moisture ruins the reaction, creating foam or bubbles in the resin, especially in polyurethane systems.

Excessive linear shrinkage or stress from thermal shock.

Apply a soft coating (gel/silicone) before potting, or dispense moderate thicknesses of resin.

First, the two components must be correctly batched by weight according to the ratio indicated by the manufacturer, and then mixed slowly.

To limit air bubbles if acting manually, you must mix slowly; alternatively, it is useful to use a proportioning, mixing, and dispensing machine.

The secret lies in the speed and the movement. You must mix slowly, with regular and smooth “figure-eight” movements, scraping the walls and the bottom of the container thoroughly. Never lift the spatula from the bottom of the container to avoid the “whipping” effect that traps air.

Kapton tape, which withstands temperatures above 260°C for short periods and has high dielectric strength. It is used to insulate component terminals, battery packs, and to mask circuits during wave or reflow soldering.

Generally no, except for emergency repairs or low-voltage prototypes at room temperature. PVC tape is too thick, has poor thermal resistance (the adhesive melts and bleeds at around 60-80°C), and can release chemicals that corrode copper traces over time.

Nomex is a synthetic aramid paper tape. It is preferred in transformers and electric motors because, due to its porous nature, it perfectly absorbs impregnating resins or varnishes, eliminating air pockets and improving structural insulation compared to smooth polyimide film.

They are metal foil tapes, usually copper or aluminum, equipped with a special adhesive that can be electrically conductive. They are used to create barriers against electromagnetic interference (EMI) and radio frequency interference (RFI), wrap sensitive wiring, or line the inside of plastic device enclosures to prevent disturbance on the circuit.

It is a metal alloy. Lead-Free is currently the most widely used solder, where tin is alloyed with other metals such as Silver and Copper. Leaded tin wire is strictly restricted and remains permitted (via specific RoHS exemptions) exclusively in high-reliability sectors, e.g., aerospace, military, critical safety, and certain medical applications.

Cored wire contains one or more longitudinal channels inside filled with chemical deoxidizing flux; solid wire is a 100% compact metal wire composed solely of the solder alloy, totally devoid of flux inside.

The wire diameter must be proportioned to the size of the pad to be soldered to avoid dosing too much or too little material.